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MMBF2201NT1
Preferred Device
Power MOSFET 300 mAmps, 20 Volts
N-Channel SC-70/SOT-323
These miniature surface mount MOSFETs low RDS(on) assure minimal power loss and conserve energy, making these devices ideal for use in small power management circuitry. Typical applications are d c -d c c o n v e r t e r s , p o w e r m a n a g e m e n t i n p o r t a b l e a n d battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones.
Features http://onsemi.com
300 mAMPS, 20 VOLTS RDS(on) = 1 W
N-Channel 3
* Low RDS(on) Provides Higher Efficiency and Extends Battery Life * Miniature SC-70/SOT-323 Surface Mount Package Saves * Pb-Free Package is Available
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating Drain-to-Source Voltage Gate-to-Source Voltage - Continuous Drain Current - Continuous @ TA = 25C - Continuous @ TA = 70C - Pulsed Drain Current (tp 10 ms) Total Power Dissipation @ TA = 25C (Note 1) Derate above 25C Operating and Storage Temperature Range Thermal Resistance, Junction-to-Ambient Maximum Lead Temperature for Soldering Purposes, for 10 seconds Symbol VDSS VGS ID ID IDM PD 150 1.2 TJ, Tstg RqJA TL - 55 to 150 833 260 mW mW/C C C/W C Value 20 20 300 240 750 Unit Vdc Vdc mAdc 3
Board Space
1
2
MARKING DIAGRAM AND PIN ASSIGNMENT
3 Drain 1 2 SC-70/SOT-323 CASE 419 STYLE 8 N1 M G G 1 2 Gate Source N1 = Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location.
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.
ORDERING INFORMATION
Device MMBF2201NT1 MMBF2201NT1G Package SC-70/ SOT-323 SC-70/ SOT-323 (Pb-Free) Shipping 3000 Tape & Reel 3000 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2006
1
January, 2006 - Rev. 4
Publication Order Number: MMBF2201NT1/D
MMBF2201NT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage (VGS = 0 Vdc, ID = 10 mA) Zero Gate Voltage Drain Current (VDS = 16 Vdc, VGS = 0 Vdc) (VDS = 16 Vdc, VGS = 0 Vdc, TJ = 125C) Gate-Body Leakage Current (VGS = 20 Vdc, VDS = 0) ON CHARACTERISTICS (Note 2) Gate Threshold Voltage (VDS = VGS, ID = 250 mAdc) Static Drain-to-Source On-Resistance (VGS = 10 Vdc, ID = 300 mAdc) (VGS = 4.5 Vdc, ID = 100 mAdc) Forward Transconductance (VDS = 10 Vdc, ID = 200 mAdc) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Transfer Capacitance SWITCHING CHARACTERISTICS (Note 3) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Gate Charge (See Figure 5) SOURCE-DRAIN DIODE CHARACTERISTICS Continuous Current Pulsed Current Forward Voltage (Note 3) 2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%. 3. Switching characteristics are independent of operating junction temperature. IS ISM VSD - - - - - 0.85 0.3 0.75 - V A (VDD = 15 Vdc, ID = 300 mAdc, RL = 50 W) td(on) tr td(off) tf QT - - - - - 2.5 2.5 15 0.8 1400 - - - - - pC ns (VDS = 5.0 V) (VDS = 5.0 V) (VDG = 5.0 V) Ciss Coss Crss - - - 45 25 5.0 - - - pF VGS(th) rDS(on) - - gFS - 0.75 1.0 450 1.0 1.4 - mMhos 1.0 1.7 2.4 Vdc W V(BR)DSS IDSS - - IGSS - - - - 1.0 10 100 nAdc 20 - - Vdc mAdc Symbol Min Typ Max Unit
TYPICAL CHARACTERISTICS
1.0 0.9 ID , DRAIN CURRENT (AMPS) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 VGS = 3 V VGS = 2.5 V 2 3 4 5 6 7 8 VDS, DRAIN-SOURCE VOLTAGE (VOLTS) 9 10 VGS = 3.5 V RDS , ON RESISTANCE (OHMS) VGS = 4 V 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -60 -40 -20 0 20 40 60 80 TEMPERATURE (C) 100 120 140 160 VGS = 4.5 V ID = 100 mA VGS = 10 V ID = 300 mA
Figure 1. Typical Drain Characteristics http://onsemi.com
2
Figure 2. On Resistance versus Temperature
MMBF2201NT1
TYPICAL CHARACTERISTICS
10 RDS , ON RESISTANCE (OHMS) 8 6 4 2 0 ID = 300 mA RDS , ON RESISTANCE (OHMS) 1.2 1.0 0.8 0.6 0.4 0.2 0 VGS = 4.5 V
VGS = 10 V
0
1
2
3 4 5 6 7 8 GATE-SOURCE VOLTAGE (VOLTS)
9
10
0
0.1
0.2
0.3 0.4 0.5 0.6 ID, DRAIN CURRENT (AMPS)
0.7
0.8
Figure 3. On Resistance versus Gate -Source Voltage
Figure 4. On Resistance versus Drain Current
1.0 I S , SOURCE CURRENT (AMPS)
45 40 C, CAPACITANCE (pF) 35 30 25 20 15 10 5 0 Ciss Coss Crss 0 2 6 10 14 4 8 12 16 VDS, DRAIN-SOURCE VOLTAGE (VOLTS) 18 20 VGS = 0 V F = 1 mHz
0.1
0.01
0.001
0
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.1 VSD, SOURCE-DRAIN FORWARD VOLTAGE (VOLTS)
1.0
Figure 5. Source -Drain Forward Voltage
Figure 6. Capacitance Variation
1.0 0.9 I D , DRAIN CURRENT (AMPS) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VGS, GATE-SOURCE VOLTAGE (VOLTS) 4.0 4.5 -55 25 150
Figure 7. Transfer Characteristics
http://onsemi.com
3
MMBF2201NT1
PACKAGE DIMENSIONS
SC-70 (SOT-323) CASE 419-04 ISSUE M
D e1
3
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. MILLIMETERS NOM MAX 0.90 1.00 0.05 0.10 0.7 REF 0.35 0.40 0.18 0.25 2.10 2.20 1.24 1.35 1.30 1.40 0.65 BSC 0.425 REF 2.10 2.40 INCHES NOM 0.035 0.002 0.028 REF 0.014 0.007 0.083 0.049 0.051 0.026 BSC 0.017 REF 0.083
HE
1 2
E
b e
DIM A A1 A2 b c D E e e1 L HE
MIN 0.80 0.00 0.30 0.10 1.80 1.15 1.20
MIN 0.032 0.000 0.012 0.004 0.071 0.045 0.047
MAX 0.040 0.004 0.016 0.010 0.087 0.053 0.055
2.00
0.079
0.095
A 0.05 (0.002)
A2 L
c
A1
STYLE 8: PIN 1. GATE 2. SOURCE 3. DRAIN
SOLDERING FOOTPRINT*
0.65 0.025 0.65 0.025
1.9 0.075 0.9 0.035 0.7 0.028
SCALE 10:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
http://onsemi.com
4
MMBF2201NT1/D

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